 Thomas chips potting adhesive (Offer to Sell)
Trade Lead Description:
Name High temperature resistant electronic components encapsulating adhesive（THO4054）
Outline This double-component product is epoxy adhesive. It is easy and convenient to use for it solidifies fast at normal temperature and bonds well. No bubbles appear after curing thus making the surface smooth and bright. Applications It applies to the encapsulating electronic components and chips in transformers, rectifiers, AC capacitor, ignition coils, electronic modules, aquarium equipment, negative ion generator, atomizer, and other products to protect them against moisture and shock.
Heat resistance scope：-104 °F—+716 °F
volume resistance: 1×10×15Ω.cm sheet resistance 2.5×10×15Ω
voltage withstand 20-24kV/mm
hardness shore D 90
Water absorbing capacity 24h＜0.1%
Tg:300-400℃
Cementation intensity: Normal temperature:
Tensile strength≥25MPa; Shearing strength≥20 MPa
At 302 °F: Tensile strength 3－5 MPa
| Type of Offer: |
Offer to Sell |
| Quantity: |
Not Specified |
| Packaging: |
Not Specified |
| Price / Incoterms Conditions: |
Not Specified |
Posted from China - Sichuan on 24 March, 2014
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